Flexible Thermally Conductive Adhesive Electrically Insulating Epoxy Low Thermal Expansion Cooling, Thermo-Bond 58, 500gm kit(s)

Description

http://conductivex.com/Flexible-Thermally-Conductive-Adhesive-Electrically-Insulating-Epoxy-Low-Thermal-Expansion-CoolingThermo-bond 58 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. Thermo-Bond 58 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured Thermo-Bond 58 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.Appearance - GreyBenefits - Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.Components - 2Compressive - 8500Cure Schedule - 24 hours @ Room Temp2 to 4 hours @ 60CCure Type - Room Temp / Heat CureDielectric - 6Dielectric - 410Filler - Alumina Hardness - 60Heat - 125Lap - 1850Mix - 100/38Operating - from 50 to +125CParticle Size - 44Reactive - 100Shelf - 1 yearSpecific - 2.3Substrates - metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materialsTensile - 3500Thermal - 8.2Thermal - 0.85Typical - Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boardsViscosity - PasteVolume Resistivity - 2.0 E+15Working - 2 hours